Enhanced Secondary Electron Detection of Single Ion Implants in Silicon Through Thin SiO2 Layers

Deterministic placement of single dopants is essential for scalable quantum devices based on group-V donors in silicon. We demonstrate a non-destructive, high-efficiency method for detecting individual ion implantation events using secondary electrons (SEs) in a focused ion beam (FIB) system. Using low-energy Sb ions implanted into undoped silicon, we achieve up to 98% single-ion detection efficiency, verified by calibrated ion-current measurements before and after implantation. The technique attains 30 nm spatial resolution without requiring electrical contacts or device fabrication, in contrast to ion-beam-induced-current (IBIC) methods. We find that introducing a controlled SiO2 capping layer significantly enhances SE yield, consistent with an increased electron mean free path in the oxide, while maintaining high probability of successful ion deposition in the underlying substrate. The yield appears to scale with ion velocity, so higher projectile mass (e.g. Yb, Bi etc) requires increased energy to maintain detection efficiency. Our approach provides a robust and scalable route to precise donor placement and extends deterministic implantation strategies to a broad range of material systems and quantum device architectures.