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Superconducting Qubits

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

DOAJ
Authors: K. Grigoras, N. Yurttagul, J.-P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H.-X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hatinen, D. Datta, V. Vesterinen, L. Gronberg, J. Biznarova, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius

Year

2022

Paper ID

28329

Status

Peer-reviewed

Abstract Read

~2 min

Abstract Words

101

Citations

24

Abstract

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.

Why This Paper Matters

  • This paper contributes to the Superconducting Qubits research area in the Quantum Articles archive.
  • It adds a 2022 reference point for readers tracking recent quantum research.
  • We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors.

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References & Citation Signals

[1] DOI https://doi.org/10.1109/TQE.2022.3209881 [2] Publisher https://ieeexplore.ieee.org/document/9903563/

Local Citation Graph (Related-Paper Links)

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External citation index: OpenAlex citation signal • updated 2026-10-21 16:10:47

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