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Superconducting Qubits Spin Qubits Silicon Quantum Computing Quantum Chemistry

Ultrahigh Vacuum Packaging and Surface Cleaning for Quantum Devices

arXiv
Authors: M. Mergenthaler, S. Paredes, P. Müller, C. Müller, S. Filipp, M. Sandberg, J. Hertzberg, V. P. Adiga, M. Brink, A. Fuhrer

Year

2020

Paper ID

19713

Status

Preprint

Abstract Read

~2 min

Abstract Words

102

Citations

N/A

Abstract

We describe design, implementation and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of the system and present measurements of flux tunable qubits with an average T1=84 μs and Techo2=134 μs after vacuum-loading these samples into a bottom loading dilution refrigerator in the UHV-package.

Why This Paper Matters

  • This paper contributes to the Quantum Chemistry research area in the Quantum Articles archive.
  • It adds a 2020 reference point for readers tracking recent quantum research.
  • We describe design, implementation and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices.

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References & Citation Signals

[1] DOI https://doi.org/arXiv:2010.12090 [2] arXiv https://arxiv.org/abs/2010.12090 [3] Publisher https://arxiv.org/abs/2010.12090

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